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DIP300-SOIC-26W
DIP-26 (0.3" WIDTH, 0.1" PITCH)
Manufacturer: Chip Quik Inc.IC code: 315-DIP300-SOIC-26W-ND
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Description
DIP-26 (0.3" WIDTH, 0.1" PITCH)
Specifications
- Pitch
- 0.050" (1.27mm)
- Series
- -
- Material
- FR4 Epoxy Glass
- Packaging
- Bulk
- Part Status
- Active
- Manufacturer
- Chip Quik Inc.
- Board Thickness
- 0.063" (1.60mm)
- Package Accepted
- SOIC
- Proto Board Type
- SMD to DIP
- Size / Dimension
- 1.300" L x 0.400" W (33.02mm x 10.16mm)
- Number of Positions
- 26