Parts
1,000 parts
| Image | MPN | IC number | Description | Manufacturer |
|---|---|---|---|---|
 | 5496-ICKSMDK19MI-ND | Heatsink for DIL-IC, PLCC and SM | ||
| 5496-ICKSMDA13MI-ND | Heatsink for DIL-IC, PLCC and SM | ||
| 5496-ICKVB15-ND | Passive Heatsink for processors | ||
| 5496-ICKSMDO21MI-ND | Heatsink for DIL-IC, PLCC and SM | ||
| 211-3041247-ND | BERGQUIST GAP PAD TGP 10000ULM | ||
| 1754-SQD-02SBBN-PBE001-ND | LIQUID COOLING CONNECTOR, SNAPQD | ||
| 1754-SQD-04PAEM-PBE001-ND | LIQUID COOLING CONNECTOR, SNAPQD | ||
| 1168-TG-ASD35AB-50CC-ND | TWO-PART THERMAL GEL 50CC SYRING | ||
| 3196-U6-PRO-100G-ND | THERMAL PUTTY FOR VGA GPU IC PRO | ||
| 3196-K5-PRO-10G-ND | VISCOUS THERMAL PASTE FOR THERMA | ||
| 1168-TG-A20KF-95-58-2.0-ND | SILICONE THERMAL PAD 95MM X 58MM | ||
| 1168-TG-A20KF-40-33-1.0-ND | SILICONE THERMAL PAD 40MM X 33MM | ||
| 1168-TG-A20KF-48-23-4.5-ND | SILICONE THERMAL PAD 48MM X 23MM | ||
| 1168-TG-A20KF-20-18-4.0-1A-ND | SILICONE THERMAL PAD 20MM X 18MM | ||
| 1168-TG-A6200-100-100-2.0-2A-ND | SILICONE THERMAL PAD 100MM X 100 | ||
| 1168-TG-A38KX-15-13-3.0-1A-ND | SILICONE THERMAL PAD 15MM X 13MM | ||
| 1168-TG-A20KF-26-11-1.0-ND | SILICONE THERMAL PAD 26MM X 11MM | ||
| 1168-TG-A38KX-45-25-6.0-ND | SILICONE THERMAL PAD 45MM X 25MM | ||
| 2503-iG60FC-ALBKAN-BNAA-ND | Zynq ZU48/47/43DR RFSoC SOM HSK | ||
| 1528-977-ND | TO-220 CLIP-ON HEATSINK |
ICK SMD K 19 MI
5496-ICKSMDK19MI-ND
Heatsink for DIL-IC, PLCC and SM
Fischer Elektronik
ICK SMD A 13 MI
5496-ICKSMDA13MI-ND
Heatsink for DIL-IC, PLCC and SM
Fischer Elektronik
ICK VB 15
5496-ICKVB15-ND
Passive Heatsink for processors
Fischer Elektronik
ICK SMD O 21 MI
5496-ICKSMDO21MI-ND
Heatsink for DIL-IC, PLCC and SM
Fischer Elektronik